Semiconductor packaging and testing equipment

Semiconductor packaging and testing equipment

SDM-820 Water Jet System
    Release time:2023-06-05    


Product Information

Use : Using high-pressure water to flash the Lead Frame, including point solutions.

Feature : Process flow: loading - point digestion - cleaning - high-pressure water - blow drying - drying - unloading

Parameter : High pressure water: 0-500kg adjustable. The speed of the steel strip is 6m/min. Applicable product: IMC-2L/VSSOP8/IMD-5L The product width is adjustable within 100mm.