Semiconductor packaging and testing equipment

Semiconductor packaging and testing equipment

UV Curing Machine
    Release time:2023-06-05    


Product Information

Use : 8/12 Inch Wafer UV

Feature :  8/12 Inch compatible, LED UV SECS/GEM Function

Parameter : UV wavelength: 250-500nm, irradiation intensity: 40mw/cm ² UPH 90-100 PCS/H