Product features:

This equipment is used in the Class 10 purification workshop to perform UV debonding on 8-inch/12 inch wafers. Can have two material boxes up and down at the same time.

The wafer robot recognizes the mapping of the scanning box and compares the box information with SECS/GEM and EAP. After successful comparison, the wafer robot takes an 8-inch or 12 inch ring and places it on two UV debonding platforms. The UV lamp moves uniformly to release glue, and the UV power can be controlled and monitored. After the debonding is completed, the Ring is placed back into the material box using the wafer robot.