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Semiconductor packaging and testing equipment

Semiconductor packaging and testing equipment

Semiconductor packaging and testing equipment
SWD-121 Auto Wafer detape System
    Release time:2022-04-14    


Product Information：

Use : Remove the UV film on the thinned wafer to achieve automatic collection of rings and wafer insertion

Feature : Remove the UV film on the thinned wafer to achieve automatic collection of rings and wafer insertion

Parameter : Applicable wafer size: 6/8/12 Inch UPH:>24