Semiconductor packaging and testing equipment

Semiconductor packaging and testing equipment

ChallenS I ASA System
    Release time:2022-04-14    


Product Information

Use : ASA Unit Heat Dissipation Cover Installation and Pressing

Feature : Vision positioning, Robot fitting, motion following force control, servo press pressing, SECS/GEM Function

Parameter : Fitting/pressing accuracy 0.05mm, UPH: 31X31 product>800